Part Number:800002 Length: 29.97 mm (1.18 in.) Width: 29.97 mm (1.18 in.) Height: 9.4 mm (0.37 in.) Standoff: 0 mm (0 in.) Device: BGA, FPGA Material: Aluminum Finish: Black Anodize Heat Sink Mounting Direction: Horizontal, Vertical Heat Sink Mounting: Tape Device Attachment: T405R Chomerics Tape for Metal Surfaces Cross Reference: N/A RoHS: Compliant
We are known as one of the leading heat- sinks and relating hardware manufacturers and suppliers in China. Please rest assured to buy our aluminum black anodize fpga heat sink extrusion, and the customized orders are also welcome. For quotation, welcome to contact our factory.