Length: 35 mm (1.378 in.) Width: 35 mm (1.378 in.) Height: 18 mm (0.709 in.) Standoff: 0 mm (0 in.) Device: BGA, FPGA Material: Aluminum Finish: Black Anodize or nature anodize or customized Heat Sink Mounting Direction: Horizontal, Vertical Heat Sink Mounting: Tape package: tray and box Device Attachment: T411 Chomerics Tape for Plastic Surfaces or customized RoHS: Compliant
We are known as one of the leading heat- sinks and relating hardware manufacturers and suppliers in China. Please rest assured to buy our extruded heat sink enclosure, and the customized orders are also welcome. For quotation, welcome to contact our factory.