extruded heat sink profiles Length: 35 mm (1.378 in.) Width: 35 mm (1.378 in.) Height: 10 mm (0.394 in.) Standoff: 0 mm (0 in.) Device: BGA, FPGA Material: Aluminum Finish: Black Anodize Heat Sink Mounting Direction: Horizontal, Vertical Heat Sink Mounting: Tape Device Attachment: T411 Chomerics Tape for All Surfaces RoHS: Compliant
We are known as one of the leading heat- sinks and relating hardware manufacturers and suppliers in China. Please rest assured to buy our extruded heat sink profiles, and the customized orders are also welcome. For quotation, welcome to contact our factory.