Copper Skived Fin Heat Sink Manufacturing
Length: 40 mm (1.575 in.)
Width: 40.5 mm (1.594 in.)
Height: 13.5 mm (0.531 in.)
Standoff: 0 mm (0 in.)
Device: BGA, FPGA
Finish: AavSHIELD 3C
Heat Sink Mounting Direction: Horizontal
Heat Sink Mounting: Brass Push Pins
Device Attachment: Laird TPCM 585 Phase Change Material
It’s manufactured with cutting tool to slice the metal material into thin pieces. It can has more fins as volumed length and thin fin could maximize the thermal dissipation area, then it has a greater thermal performance. Both Aluminum and copper are acceptable.
However, the height of heat sink in this process and the shape are limited.
The benefits of skived fin heat sink
● To get very thin high ratio fins to win max area to dissipate heat in a limited area.
● Reducing thermal resistance
● Long-lasting durability for frequent use
● Creating excellent surface for heat dissipation
●Inexpensive tooling cost